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IPC-4103 - Specification for Base Materials for High Speed/High Frequency Applications
November 1, 2017 - IPC

This specification covers the requirements for high speed/high frequency performance plastic substrates to be used for fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. This specification applies to the plastic substrate thickness...

IPC/ECA J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
November 1, 2017 - IPC

This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. This standard also includes a test method for the resistance to...

IPC-TM-650 2.4.25 - Glass Transition Temperature and Cure Factor by DSC
November 1, 2017 - IPC

This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg, metallic clad or unclad laminate, and printed boards. It also provides a determination of relative degree...

IPC-A-610 GERMAN - Acceptability of Electronic Assemblies
October 1, 2017 - IPC
A description is not available for this item.
J-STD-001 GERMAN - Anforderungen an gelötete elektrische und elektronische Baugruppen
October 1, 2017 - IPC
A description is not available for this item.
IPC-A-610 HUNGARIAN - Acceptability of Electronic Assemblies
October 1, 2017 - IPC
A description is not available for this item.
IPC-A-610 CZECH - Acceptability of Electronic Assemblies
October 1, 2017 - IPC
A description is not available for this item.
J-STD-001 REDLINE - Requirements for Soldered Electrical and Electronic Assemblies
October 1, 2017 - IPC

This Standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this...

J-STD-001 ESTONIAN - Requirements for Soldered Electrical and Electronic Assemblies
October 1, 2017 - IPC
A description is not available for this item.
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