CENELEC - EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 April 2016 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Document History
EN 61189-3-719
April 1, 2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
This part of IEC 61189 specifies a test method to monitor the resistance of single platedthrough holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical...