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IEC 61760-2

Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide

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Organization: IEC
Publication Date: 1 April 2007
Status: active
Page Count: 12
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

61760-2
July 1, 2021
Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...
IEC 61760-2
April 1, 2007
Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide
A description is not available for this item.
IEC 61760-2
February 1, 1998
Surface Mounting Technology - Part 2: Transportation and Storage Conditions of Surface Mounting Devices (SMD) - Application Guide
A description is not available for this item.

References

This document is referenced by:
EN IEC 61760-3 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by CENELEC on March 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
This document is referenced by:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document is referenced by:
CEI EN 60115-1 - Fixed resistors for use in electronic equipment Part 1: Generic specification
Published by CEI on February 1, 2016
Foreword This document (EN 60115-1:2011/A11:2015) has been prepared by CLC/TC 40XB "Resistors". The following dates are fixed: • latest date by which this document has to be implemented at national...
This document is referenced by:
EN IEC 61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by CENELEC on November 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
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