scope:

This document defines a test sequence that will quickly uncover CPV module failures that have been associated with field exposure to thermal cycling for many years. This document was specifically developed to relate to thermal fatigue failure of the HCPV die-attach, however, it also applies, to some extent, to all thermal fatigue related failure mechanisms for the assemblies submitted to test.

IEC 62108, the CPV module qualification test already includes an accelerated thermal cycle sequence in one leg of the testing, however, the parameters of that test only represent a qualification level of exposure. This test procedure applies more stress and will provide a route for comparative testing to differentiate CPV modules with improved durability to thermal cycling and the associated mechanical stresses.