CEI EN 61189-5-503
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
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| Organization: | CEI |
| Publication Date: | 1 December 2017 |
| Status: | active |
| Page Count: | 32 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperaturehumidity cyclic test and an unsaturated pressurized vapour test (HAST).
Document History
CEI EN 61189-5-503
December 1, 2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperaturehumidity...