BSI - BS DD IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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| Organization: | BSI |
| Publication Date: | 31 October 2007 |
| Status: | active |
| Page Count: | 32 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS DD IEC/PAS 61249-3-1
October 31, 2007
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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