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CENELEC - EN 61189-5-503

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

active, Most Current
Organization: CENELEC
Publication Date: 1 August 2017
Status: active
Page Count: 30
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but a

Document History

EN 61189-5-503
August 1, 2017
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
This part of IEC 61189 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but a

References

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