BSI - BS EN IEC 61189-5-503
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
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| Organization: | BSI |
| Publication Date: | 30 April 2018 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-5-503
April 30, 2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies Part 5-503: General test method for materials and assemblies – Conductive anodic filaments (CAF) testing of circuit boards
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