Design Guide for the Packaging of High Speed Electronic Circuits
|Publication Date:||1 November 2003|
The goal in electronic packaging is to transfer a signal from one device to one or more other devices through a conductor. Considerations include electrical noise, electromagnetic interference, signal propagation time, thermo-mechanical environmental protection, and heat dissipation. High-speed designs are defined as designs in which the interconnecting properties affect circuit function and require consideration. Every electrical concept has relevant physical implementation data and limitations provided to match the electrical and mechanical relationships. This guideline presents first order approximations for each of the subject areas covered. If more detail is required, the papers presented in the bibliography may provide more detailed supplemental data. Since most high speed design requires signal integrity and EMI techniques, often field solvers, signal integrity simulation tools, EMI/EMC simulation programs may be required for resolving design challenges. Many PWB layout design tools include these tools as options to their programs. These simulators are driven by SPICE, IBIS, or other models. References to manufacturers of these tools may be found on the IPC Web site (www.ipc.org).