JEDEC JESD 51-31
Thermal Test Environment Modifications for MultiChip Packages
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| Organization: | JEDEC |
| Publication Date: | 1 July 2008 |
| Status: | active |
| Page Count: | 18 |
scope:
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared.
Document History
JEDEC JESD 51-31
July 1, 2008
Thermal Test Environment Modifications for MultiChip Packages
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained...
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