IPC-C-106
PRINTED BOARD DESIGN STANDARDS COLLECTION
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| Organization: | IPC |
| Publication Date: | 1 June 2008 |
| Status: | active |
scope:
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each area.
The goal in packaging is to transfer a signal from one device to one or more other devices, through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique consideration.
Document History
IPC-C-106
June 1, 2008
PRINTED BOARD DESIGN STANDARDS COLLECTION
This guide is intended to be used by circuit designers, packaging engineers, printed board fabricators, and procurement personnel so that all may have a common understanding of each area.
The goal in...