IEC 62418
Semiconductor devices – Metallization stress void test
active, Most Current
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| Organization: | IEC |
| Publication Date: | 1 April 2010 |
| Status: | active |
| Page Count: | 38 |
| ICS Code (Semiconductor devices): | 31.080 |
scope:
This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
This standard is applicable for reliability investigation and qualification of semiconductor process.
Document History
IEC 62418
April 1, 2010
Semiconductor devices – Metallization stress void test
This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.
This standard is applicable...