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IEC 62418

Semiconductor devices – Metallization stress void test

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Organization: IEC
Publication Date: 1 April 2010
Status: active
Page Count: 38
ICS Code (Semiconductor devices): 31.080
scope:

This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

This standard is applicable for reliability investigation and qualification of semiconductor process.

Document History

IEC 62418
April 1, 2010
Semiconductor devices – Metallization stress void test
This International Standard describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization. This standard is applicable...

References

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