UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-2221 CHINESE

Generic Standard on Printed Board Design

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 May 2003
Status: active
Page Count: 128
scope:

This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be homogeneous, reinforced, or used in combination with inorganic materials; the interconnections may be single, double, or multilayered.

Purpose The requirements contained herein are intended to establish design principles and recommendations that shall be used in conjunction with the detailed requirements of a specific interconnecting structure sectional standard (see 1.2) to produce detailed designs intended to mount and attach passive and active components. This standard is not intended for use as a performance specification for finished boards nor as an acceptance document for electronic assemblies. For acceptability requirements of electronic assemblies, see IPC/EIA-J-STD- 001 and IPC-A-610.

The components may be through-hole, surface mount, fine pitch, ultra-fine pitch, array mounting or unpackaged bare die. The materials may be any combination able to perform the physical, thermal, environmental, and electronic function.

 

Document History

IPC-2221 CHINESE
May 1, 2003
Generic Standard on Printed Board Design
This standard establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures. The organic materials may be...

References

Advertisement