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IEC 62374-1

Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

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Organization: IEC
Publication Date: 1 September 2010
Status: active
Page Count: 36
ICS Code (Semiconductor devices): 31.080
scope:

This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Document History

IEC 62374-1
September 1, 2010
Semiconductor devices – Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor...

References

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