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CEI EN 60068-2-58

Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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Organization: CEI
Publication Date: 1 August 2018
Status: active
Page Count: 14
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040
scope:

Replace the existing second paragraph of the Scope with the following new paragraph:

This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

Document History

CEI EN 60068-2-58
August 1, 2018
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Replace the existing second paragraph of the Scope with the following new paragraph: This document provides procedures for determining the solderability, resistance to dissolution of metallization...
January 1, 2016
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This standard provides procedures for determining the solderability and resistance to soldering heat of devices...
August 1, 2005
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
La presente Norma fa parte della serie 60068 e descrive la prova Td applicabile ai dispositivi a montaggio superficiale su substrati. Vengono trattate leghe di saldatura con e senza piombo (Lead...
August 1, 2001
Prove ambientali - Parte 2-58: Prove - Prova Td: Metodi di prova per la saldabilità, resistenza alla dissoluzione della lega saldante e al calore di saldatura dei dispositivi a montaggio superficiale
La presente Norma definisce la prova Td applicabile ai dispositivi per il montaggio superficiale (SMD). Le prove di saldatura applicabili agli SMD nella IEC 60068-2-69 e ad altri prodotti...
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