CEI EN 60068-2-58
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
|Publication Date:||1 August 2018|
|ICS Code (Electronic component assemblies):||31.190|
|ICS Code (Environmental testing):||19.040|
Replace the existing second paragraph of the Scope with the following new paragraph:
This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.