CEI EN 61760-4
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
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Organization: | CEI |
Publication Date: | 1 August 2018 |
Status: | active |
Page Count: | 14 |
ICS Code (Electronic component assemblies): | 31.190 |
scope:
INTRODUCTION
It is important to note that moisture sensitivity levels existing in both J-STD 020 and IEC 61760-4 are equivalent.
Document History
CEI EN 61760-4
August 1, 2018
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
INTRODUCTION
It is important to note that moisture sensitivity levels existing in both J-STD 020 and IEC 61760-4 are equivalent.
February 1, 2016
Surface mounting technology Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
This part of IEC 61760 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling....