CEI EN 61189-5-1
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
|Publication Date:||1 March 2017|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies.