MODUK - DEF STAN 81-83
Bonded Polyurethane Chipfoam
|Publication Date:||11 April 2016|
This Standard specifies requirements for four grades of bonded polyether urethane Chipfoam used as resilient cushioning material for the packaging of fragile supplies.
This Standard does not cover special purpose oil-resistant, anti-static, or non-flammable polyurethane Chipfoam.