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MODUK - DEF STAN 81-83

Bonded Polyurethane Chipfoam

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Organization: MODUK
Publication Date: 11 April 2016
Status: active
Page Count: 16
scope:

This Standard specifies requirements for four grades of bonded polyether urethane Chipfoam used as resilient cushioning material for the packaging of fragile supplies.

This Standard does not cover special purpose oil-resistant, anti-static, or non-flammable polyurethane Chipfoam.

Document History

DEF STAN 81-83
April 11, 2016
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyether urethane Chipfoam used as resilient cushioning material for the packaging of fragile supplies. This Standard does not cover...
November 10, 2006
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyether urethane chipfoam used as resilient cushioning material for the packaging of fragile supplies. This Standard does not cover...
November 7, 1997
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bondedpolyether urethane chipfoam used as resilient cushioning material for the packaging of fiagile supplies. This Standard does not cover...
June 14, 1989
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyurethane chipfoam used as a resilient cushioning material for the packaging of fragile supplies. General requirements applicable to...

References

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