IPC - TM-650 2.5.27
Surface Insulation Resistance of Raw Printed Wiring Board Material
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 1979 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is designed to determine the surface insulation resistance of dielectric material after the prescribed conditioning cycles.
Document History
TM-650 2.5.27
March 1, 1979
Surface Insulation Resistance of Raw Printed Wiring Board Material
This test method is designed to determine the surface insulation resistance of dielectric material after the prescribed conditioning cycles.