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DOD - SMD 5962-11018

INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603

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Organization: DOD
Publication Date: 12 September 2011
Status: active
Page Count: 8
scope:

This drawing describes the requirements for inductors, SMD, chip. These inductors are composed of a single or double layer dielectric thin film and are of small size and tight tolerances.

Document History

DESC-DWG-11018
March 26, 2021
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
A description is not available for this item.
SMD 5962-11018
September 12, 2011
INDUCTORS, SMD, CHIP, THIN FILM, TIGHT TOLERANCE, 0603
This drawing describes the requirements for inductors, SMD, chip. These inductors are composed of a single or double layer dielectric thin film and are of small size and tight tolerances.

References

This document references:
IEC 60068-2-21 - Environmental testing – Part 2-21:Tests – Test U: Robustness of terminations and integral mounting devices
Published by IEC on January 1, 2012
This part of IEC 60068 is applicable to all electrical and electronic components whose terminations or integral mounting devices are liable to be submitted to stresses during normal assembly or...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
MIL-STD-1285 - MARKING OF ELECTRICAL AND ELECTRONIC PARTS
Published by NPFC on July 8, 2019
Scope. This standard establishes requirements for the physical marking of electrical and electronic parts. This standard should be implemented by incorporating suitable requirements directly in...
This document references:
MIL-STD-883 - TEST METHOD STANDARD MICROCIRCUITS
Published by NPFC on September 16, 2019
Purpose. This standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within Military and Aerospace electronic systems including basic...
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