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IEC 62047-37

Semiconductor devices – Micro-electromechanical devices – Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application

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Organization: IEC
Publication Date: 1 April 2020
Status: active
Page Count: 38
ICS Code (Piezoelectric devices): 31.140
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.

This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.

Document History

IEC 62047-37
April 1, 2020
Semiconductor devices – Micro-electromechanical devices – Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical...

References

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