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NEN-EN-IEC 62878-1

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

active, Most Current
Organization: NEN
Publication Date: 1 December 2019
Status: active
Page Count: 32
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.

This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.

The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Document History

NEN-EN-IEC 62878-1
December 1, 2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
This part of IEC 62878 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are...

References

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