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ECIA - EIA-886

Resistors, Thick Film Resistor Array on Ceramic

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Organization: ECIA
Publication Date: 1 August 2020
Status: active
Page Count: 16
scope:

Introduction

This specification defines the requirements for a family of thick film chip resistor arrays in ceramic with various configurations and package sizes.

Document History

EIA-886
August 1, 2020
Resistors, Thick Film Resistor Array on Ceramic
Introduction This specification defines the requirements for a family of thick film chip resistor arrays in ceramic with various configurations and package sizes.
EIA-886
May 1, 2014
Thick Film Resistor Array Specification
Introduction This specification defines the requirements for a family of thick film chip resistor arrays in ceramic with various configurations and package sizes.
EIA-886
July 1, 2006
THICK FILM RESISTOR ARRAY SPECIFICATION
Introduction This specification defines the requirements for a family of thick film chip resistor arrays in ceramic with various configurations and package sizes.
EIA-886
April 1, 2001
Thick Film Resistor Array Specification
A description is not available for this item.

References

This document references:
EIA-481 - 8 mm Through 200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling
Published by ECIA on January 1, 2015
This Standard covers requirements for taping surface mount components. Complementary standards for specialized taping requirements are included in the addendum.
This document references:
EIA-541 - Packaging Material Standards for ESD Sensitive Items
Published by ECIA on June 1, 1988
This standard applies to several different categories of electrostatic protective packaging materials. These packaging materials may possess certain electrostatic properties such as to prevent...
This document references:
EIA-977 - Test Method – Electronic Passive Components Exposure to Atmospheric Sulfur
Published by ECIA on February 1, 2017
This standard defines options for testing passive electronic components for susceptibility to the effects of environmental sulfur. Such susceptibility results in the corrosion of silver in the...
This document references:
IPC/ECA J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Published by IPC on January 1, 1992
A description is not available for this item.
This document references:
MIL-PRF-55342 - RESISTOR, CHIP, FIXED, FILM, NONESTABLISHED RELIABILITY, ESTABLISHED RELIABILITY, SPACE LEVEL, GENERAL SPECIFICATION FOR
Published by NPFC on March 17, 2020
A description is not available for this item.
This document references:
MIL-STD-202 - TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS
Published by NPFC on February 6, 1956
A description is not available for this item.
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