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BSI - BS EN 60664-3 - TC

Tracked Changes (Redline) - Insulation coordination for equipment within low-voltage systems Part 3: Use of coating, potting or moulding for protection against pollution

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Organization: BSI
Publication Date: 25 February 2020
Status: active
Page Count: 70
ICS Code (Insulation systems): 29.080.30

Document History

BS EN 60664-3 - TC
February 25, 2020
Tracked Changes (Redline) - Insulation coordination for equipment within low-voltage systems Part 3: Use of coating, potting or moulding for protection against pollution
A description is not available for this item.

References

This document references:
IEC 61249-2-10 - Materials for printed boards and other interconnecting structures Part 2-10: Reinforced base materials clad and unclad Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Published by IEC on February 1, 2003
A description is not available for this item.
This document references:
IEC 61249-2-11 - Materials for printed boards and other interconnecting structures Part 2-11: Reinforced base materials clad and unclad - polyimide, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Published by IEC on November 1, 2003
A description is not available for this item.
This document references:
IEC 61249-2-12 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-12: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Epoxide Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad
Published by IEC on January 1, 1999
A description is not available for this item.
This document references:
IEC 61249-2-13 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-13: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Cyanate Ester Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad
Published by IEC on February 1, 1999
A description is not available for this item.
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