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BSI - BS IEC 60747-6 - TC

Tracked Changes (Redline) - Semiconductor devices Part 6: Discrete devices - Thyristors

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Organization: BSI
Publication Date: 27 February 2020
Status: active
Page Count: 378
ICS Code (Thyristors): 31.080.20

Document History

BS IEC 60747-6 - TC
February 27, 2020
Tracked Changes (Redline) - Semiconductor devices Part 6: Discrete devices - Thyristors
A description is not available for this item.

References

This document references:
IEC 60749-23 - Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life
Published by IEC on March 1, 2011
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily...
This document references:
IEC 60050-113 - AMENDMENT 2 International Electrotechnical Vocabulary (IEV) – Part 113: Physics for electrotechnology
Published by IEC on October 1, 2019
A description is not available for this item.
This document references:
IEC 60050-521 - AMENDMENT 2 International Electrotechnical Vocabulary (IEV) – Part 521: Semiconductor devices and integrated circuits
Published by IEC on December 1, 2018
A description is not available for this item.
This document references:
IEC 60747-1 - Semiconductor devices – Part 1: General
Published by IEC on August 1, 2010
This part of IEC 60747 gives the general requirements applicable to the discrete semiconductor devices and integrated circuits covered by the other parts of IEC 60747 and IEC 60748 (see Annex A).
This document references:
IEC 60749-23 - Semiconductor devices – Mechanical and climatic test methods – Part 23: High temperature operating life
Published by IEC on March 1, 2011
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily...
This document references:
IEC 60749-25 - Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling
Published by IEC on July 1, 2003
This part of IEC 60749 provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating...
This document references:
IEC 60749-34 - Semiconductor devices – Mechanical and climatic test methods – Part 34: Power cycling
Published by IEC on October 1, 2010
Scope and object This part of IEC 60749 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of...
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