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AIA/NAS - NAS4121

HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED

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Organization: AIA/NAS
Publication Date: 28 August 2020
Status: active
Page Count: 18

Document History

NAS4121
August 28, 2020
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
A description is not available for this item.
NAS4121
January 27, 2012
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
A description is not available for this item.
NAS4121
January 27, 2012
HEAT SINK, ELECTRICAL, ELECTRONIC COMPONENT, SEMICONDUCTOR DEVICES, FORMED
A description is not available for this item.
NAS4121
January 1, 1996
Heat Sink, Electrical- Electronic Component, Semiconductor Devices, Formed
A description is not available for this item.

References

This document references:
ASME Y14.5 - Dimensioning and Tolerancing
Published by ASME on January 1, 2018
INTRODUCTION This Standard establishes symbols, rules, definitions, requirements, defaults, and recommended practices for stating and interpreting dimensioning, tolerancing, and related requirements...
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