NPFC - MIL-STD-202-215
TEST METHOD STANDARD METHOD 215, RESISTANCE TO SOLVENTS
|Publication Date:||15 December 2020|
The purpose of this test is as follows:
a. To verify that markings or color coding will not become illegible or discolored on the parts (including printed wiring boards) when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed-wiring and terminal-board assemblies, etc.
b. To verify that component protective coating, encapsulation material and sleeve material resistance are not degraded to the point where electrical or mechanical integrity is disturbed when subjected to solvents and processes normally used to clean solder flux, fingerprints, and other contaminants from printed wiring and terminal board assemblies, etc.
Formulation of solvents.
The formulation of solvents is considered typical and representative of the solvents used in printed wiring assembly processing of electronic components. Processing conditions are representative of processes used for printed wiring assembly.
Checks for conflicts.
When this test is referenced, care should be exercised to assure that conflicting requirements, as far as the properties of the specified finishes and markings are concerned, are not invoked.