scope:

This standard establishes and defines the qualification and performance requirements for printed electronics and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or devices which have some amount of flexibility or bendability but are not considered to be stretchable (e.g., fabrics, textiles, stretchable polymers, etc.). The substrate can be conductive, semiconductive or nonconductive.

Purpose

The purpose of this specification is to provide requirements for qualification and performance of flexible printed electronics designed to IPC-2292.