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CENELEC - EN IEC 61760-3

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering

active, Most Current
Organization: CENELEC
Publication Date: 1 March 2021
Status: active
Page Count: 34
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.

The object of this document is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines test and requirements that need to be part of any component generic, sectional or detail specification, when through-hole reflow soldering is intended.

Furthermore, this document provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.

Document History

EN IEC 61760-3
March 1, 2021
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
April 1, 2010
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Scope and object This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that...

References

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