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JEDEC JEP 178

Electrostatic Discharge (ESD) Sensitivity Testing – Reporting ESD Withstand Levels on Datasheets

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Organization: JEDEC
Publication Date: 1 April 2021
Status: active
Page Count: 14
scope:

This document applies to ESD withstand level information in datasheets or other information publications such as reliability or qualification reports. All packaged semiconductor devices, thin film circuits, surface acoustic wave (SAW) devices, optoelectronic devices, hybrid integrated circuits (HICs), and multi-chip modules (MCMs) should have this information provided.

NOTE This document does not apply to electrically-initiated explosive devices, flammable liquids, or powders.

Document History

JEDEC JEP 178
April 1, 2021
Electrostatic Discharge (ESD) Sensitivity Testing – Reporting ESD Withstand Levels on Datasheets
This document applies to ESD withstand level information in datasheets or other information publications such as reliability or qualification reports. All packaged semiconductor devices, thin film...

References

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