Area Array Package Assembly and Manufacturing Practices for Flight Hardware
|Publication Date:||30 July 2021|
The purpose of this standard is to provide requirements and recommendations intended to facilitate production of defect-free area array solder joint interconnects to printed circuit boards intended for use in Flight, Flight Spare and Custom Mission Critical Support Hardware applications. This standard does not provide application specific reliability test requirements (e.g. qualification requirements).
This standard is applicable to all uses on Flight, Flight Spare and Custom Mission Critical Support Hardware of area array packaged electronic parts that are solder-attached to printed circuit boards with solder columns, balls, springs, or other area array attachment technologies.
Risk Classes per GPR 8705.4
Requirements herein that are unique to a certain mission risk class (e.g., Class C or Class D) shall be applied in accordance with the mission risk classification as assigned by NASA Headquarters or other stakeholder as applicable. Requirements herein that are not associated with a particular mission risk class are applicable to all mission risk classes.
In-house vs. Out-of-house
This standard applies in total for in-house projects at GSFC and out-of-house projects to the extent that it is called out from a directive or project document, such as the project MAR.
Order of Precedence
This standard establishes quality requirements for the attachment of area array packages to PCBs but does not supersede nor waive established Agency requirements found in other documentation. Where there are conflicts between the requirements found in this standard and the standards in Section 2, the requirements of this standard take precedence.