BSI - BS EN IEC 62878-2-602
Device embedding assembly technology Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 August 2021 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 62878-2-602
August 31, 2021
Device embedding assembly technology Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
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