scope:

In this Part 14 cooling methods below 100 K are described. These low temperature levels are mainly required by space borne electronic systems operating under very low noise conditions. Details on the materials used and safety factors are given.

The Thermal design handbook is published in 16 Parts

TR 17603-31-01 Thermal design handbook - Part 1: View factors

TR 17603-31-02 Thermal design handbook - Part 2: Holes, Grooves and Cavities

TR 17603-31-03 Thermal design handbook - Part 3: Spacecraft Surface Temperature

TR 17603-31-04 Thermal design handbook - Part 4: Conductive Heat Transfer

TR 17603-31-05 Thermal design handbook - Part 5: Structural Materials: Metallic and Composite

TR 17603-31-06 Thermal design handbook - Part 6: Thermal Control Surfaces

TR 17603-31-07 Thermal design handbook - Part 7: Insulations

TR 17603-31-08 Thermal design handbook - Part 8: Heat Pipes

TR 17603-31-09 Thermal design handbook - Part 9: Radiators

TR 17603-31-10 Thermal design handbook - Part 10: Phase - Change Capacitors

TR 17603-31-11 Thermal design handbook - Part 11: Electrical Heating

TR 17603-31-12 Thermal design handbook - Part 12: Louvers

TR 17603-31-13 Thermal design handbook - Part 13: Fluid Loops

TR 17603-31-14 Thermal design handbook - Part 14: Cryogenic Cooling

TR 17603-31-15 Thermal design handbook - Part 15: Existing Satellites

TR 17603-31-16 Thermal design handbook - Part 16: Thermal Protection System