BSI - BS EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
active, Most Current
| Organization: | BSI |
| Publication Date: | 30 November 2021 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Open systems interconnection in general): | 35.100.01 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-2-807
November 30, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
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