IEC - TR 62878-2-9
Device embedding assembly technology – Part 2-9: Guidelines – Concept of JISSO Level in the electronic assembly technology industries
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 April 2022 |
| Status: | active |
| Page Count: | 20 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
The purpose of this Technical Report is to comprise the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members about the "concept of Jisso" as well as the "Jisso product level" for the common understanding on IEC TC 91 (electronic assembly technology) activities was reached.
Further discussion on "Jisso Product Level" could be needed among the current JIC members to finalize it in the near future based on this technical report.
Document History
TR 62878-2-9
April 1, 2022
Device embedding assembly technology – Part 2-9: Guidelines – Concept of JISSO Level in the electronic assembly technology industries
The purpose of this Technical Report is to comprise the long-term discussion among Jisso International Council (JIC) members during 1999 and 2005, when the interim agreement among all JIC members...