BSI - BS EN IEC 60749-10
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - device and subassembly
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 August 2022 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
BS EN IEC 60749-10
August 31, 2022
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - device and subassembly
A description is not available for this item.
August 28, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock
A description is not available for this item.
August 28, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock
A description is not available for this item.