BSI - PD IEC TR 61760-3-1
Surface mounting technology Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method
active, Most Current
| Organization: | BSI |
| Publication Date: | 30 September 2022 |
| Status: | active |
| Page Count: | 30 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
PD IEC TR 61760-3-1
September 30, 2022
Surface mounting technology Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering - Guidelines for through hole diameter design with solder paste surface printing method
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