IPC - 7092A
Design and Assembly Process Implementation for Embedded Circuitry
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 October 2022 |
| Status: | active |
| Page Count: | 124 |
scope:
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
Document History
7092A
October 1, 2022
Design and Assembly Process Implementation for Embedded Circuitry
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related...
February 1, 2015
Design and Assembly Process Implementation for Embedded Components
This document describes the design and assembly challenges for implementing passive and active components, in either formed or placed methodology, into a printed board. The completed structure...