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BSI - PD IEC TR 61191-9

Printed board assemblies Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications — Best practices

active, Most Current
Organization: BSI
Publication Date: 30 June 2023
Status: active
Page Count: 76
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180

Document History

PD IEC TR 61191-9
June 30, 2023
Printed board assemblies Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications — Best practices
A description is not available for this item.

References

This document references:
IEC 60068-2-30 - Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic (12 h + 12 h cycle)
Published by IEC on August 1, 2005
This part of IEC 60068 determines the suitability of components, equipment or other articles for use, transportation and storage under conditions of high humidity – combined with cyclic temperature...
This document references:
IEC 60068-2-67 - Environmental testing – Part 2-67: Tests – Test Cy: Damp heat, steady state, accelerated test primarily intended for components
Published by IEC on July 1, 2019
This International Standard provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non hermetically...
This document references:
IEC 60194-1 - Printed boards design, manufacture and assembly – Vocabulary – Part 1: Common usage in printed board and electronic assembly technologies
Published by IEC on February 1, 2021
This part of IEC 60194 covers terms and definitions closely related with TC 91 technology.
This document references:
IEC 60194-2 - Printed boards design, manufacture and assembly – Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Published by IEC on December 1, 2017
This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies
This document references:
IEC 61189-5-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes
Published by IEC on January 1, 2021
This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long...
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