scope:

This standard establishes the procedure for testing, evaluating, and classifying devices and microcircuits according to their susceptibility (sensitivity) to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).

All packaged semiconductor devices, thin film circuits, acoustic wave devices, optoelectronic devices, hybrid integrated circuits (HICs), discrete, and multi-chip modules (MCMs) containing any of these devices as well as unpackaged singulated bare die, and die which are still part of a wafer are to be evaluated according to this standard.

Purpose

The purpose (objective) of this standard is to establish a test method that will replicate HBM failures and provide reliable, repeatable HBM ESD test results from tester to tester, regardless of device type. Repeatable data will allow accurate classifications and comparisons of HBM ESD sensitivity levels.