BSI - BS EN IEC 61189-2-803
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
active, Most Current
| Organization: | BSI |
| Publication Date: | 30 September 2023 |
| Status: | active |
| Page Count: | 14 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-2-803
September 30, 2023
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
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