NEN-EN-IEC 61189-2-804
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
active, Most Current
| Organization: | NEN |
| Publication Date: | 1 October 2023 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.
Document History
NEN-EN-IEC 61189-2-804
October 1, 2023
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this...