scope:

This specification establishes uniform methods to increase a component's reliability margin by decreasing the amount of applied stress (i.e., voltage, current, temperature, power, etc.) to an electronic, electrical, or electromechanical part.

Purpose

The objective of stress analysis and derating is to improve product reliability by deliberately operating components at applied stress levels (i.e., voltage, current, temperature, power, etc.) that are less than the component is rated for. Reducing the stress levels improves device reliability/durability by reducing failure rates, thereby improving the reliability and availability of the product.