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BSI - BS IEC 62899-202-9

Printed electronics Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

active, Most Current
Organization: BSI
Publication Date: 31 October 2023
Status: active
Page Count: 18
ICS Code (Inks. Printing inks): 87.080
ICS Code (Printed circuits and boards): 31.180

Document History

BS IEC 62899-202-9
October 31, 2023
Printed electronics Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test
A description is not available for this item.

References

This document references:
IEC 62899-101 - Printed electronics – Part 101: Terminology – Vocabulary
Published by IEC on October 1, 2019
This part of IEC 62899 defines terms used in the field of printed electronics, addressing topics including, but not limited to, materials, printing processes, and print characterization. It focuses...
This document references:
IEC 62899-502-1 - Printed electronics – Part 502-1: Quality assessment – Organic light emitting diode (OLED) elements – Mechanical stress testing of OLED elements formed on flexible substrates
Published by IEC on March 1, 2017
This part of IEC 62899 specifies the quality assessment methods, especially the mechanical stress test methods, for reliability assessment This document is applicable to flexible OLED elements formed...
This document references:
IEC 62899-202-5 - Printed electronics - Part 202-5: Materials - Conductive ink - Mechanical bending test of a printed conductive layer on an insulating substrate
Published by IEC on September 1, 2018
This International Standard specifies a mechanical bending test for evaluating the electrical properties of a printed conductive layer on an insulating substrate under repeated mechanical deformation.
This document references:
IEC 62951-1 - Semiconductor devices – Flexible and stretchable semiconductor devices – Part 1: Bending test method for conductive thin films on flexible substrates
Published by IEC on April 1, 2017
This part of IEC 62951 specifies a bending test method to measure the electromechanical properties or flexibility of conductive thin films deposited or bonded on flexible non-conductive substrates....
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