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IEC - 63251

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

active, Most Current
Organization: IEC
Publication Date: 1 November 2023
Status: active
Page Count: 46
ICS Code (Printed circuits and boards): 31.180
scope:

This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Document History

63251
November 1, 2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform...

References

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