scope:

This test procedure covers X-ray imaging for terrestrial applications on packaged devices but does not exclude the option to characterize on bare die or wafers as long as potential dose absorption or amplification effects are considered in the final assessment.

Terrestrial X-ray-imaging techniques are suitable for finding hidden defects in buried structures within Integrated Circuit (IC) packages. These techniques are complementary to the optical-inspection techniques used to find surface defects.

The X-ray system targeted for semiconductor product inspection can be used to replicate total cumulative dose for any X-ray exposure system (e.g., scanner imaging during shipping with IC devices inside, solder-joint inspection, and returned-material analysis) for characterization of dose effects.