BSI - BS EN IEC 63251
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 December 2023 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 63251
December 31, 2023
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
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