CENELEC - EN IEC 63251
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
| Organization: | CENELEC |
| Publication Date: | 1 December 2023 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
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