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ISO - 9455-17

Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues

active, Most Current
Organization: ISO
Publication Date: 1 January 2024
Status: active
Page Count: 28
ICS Code (Brazing and soldering): 25.160.50
scope:

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).

This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

Document History

9455-17
January 1, 2024
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as...
ISO 9455-17
December 15, 2002
Soft soldering fluxes Test methods Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
A description is not available for this item.

References

This document references:
IEC 61189-5-501 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-501: General test methods for materials and assemblies – Surface insulation resistance (SIR) testing of solder fluxes
Published by IEC on January 1, 2021
This part of IEC 61189 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. Interdigitated comb patterns comprising long...
This document references:
IEC 61249-2-7 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-7: Reinforced Base Materials Clad and Unclad - Epoxide Woven E-Glass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad
Published by IEC on March 1, 2002
A description is not available for this item.
This document references:
IPC-9201 - Surface Insulation Resistance Handbook
Published by IPC on August 1, 2007
This document is intended to cover the broad spectrum of temperature-humidity (TH) testing, associated terminology, and suggested techniques for proper testing. This edition of the Handbook primarily...
This document references:
ISO 12224-1 - Solder Wire, Solid and Flux Cored - Specification and Test Methods - Part 1: Classification and Performance Requirements
Published by ISO on June 1, 1997
A description is not available for this item.
This document references:
ISO 5725-2 - Accuracy (trueness and precision) of measurement methods and results — Part 2: Basic method for the determination of repeatability and reproducibility of a standard measurement method
Published by ISO on December 1, 2019
This document — amplifies the general principles for designing experiments for the numerical estimation of the precision of measurement methods by means of a collaborative interlaboratory experiment;...
This document references:
ISO 9453 - Soft solder alloys — Chemical compositions and forms
Published by ISO on September 1, 2020
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium. An...
This document references:
ISO 9454-1 - Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging
Published by ISO on February 1, 2016
This part of ISO 9454-1 specifies a coding system for the classification of fluxes intended for use with soft solders, according to their active fluxing ingredients, together with requirements for...
This document references:
MIL-HDBK-217 - RELIABILITY PREDICTION OF ELECTRONIC EQUIPMENT
Published by NPFC on July 10, 1992
Purpose - The purpose of this handbook is to establish and maintain consistent and uniform methods for estimating the inherent reliability (i.e., the reliability of a mature design) of military...
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