CEI EN 60191-6-3
Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
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| Organization: | CEI |
| Publication Date: | 1 May 2001 |
| Status: | active |
| Page Count: | 24 |
scope:
Norma recepita mediante l'annuncio su CEINFORMA maggio 2001.
Document History
CEI EN 60191-6-3
May 1, 2001
Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Norma recepita mediante l'annuncio su CEINFORMA maggio 2001.